03: Compact Dense Square Audio & Motion Reactive PCB

Mechanical Enclosure Dimensions

Board Width

mm

Dense square profile (default 38×38mm). 31×31mm M3 bolt pattern.

Board Length

mm

Silkscreen Size

1.0x

Turnkey Pre-Assembled Hardware Map

MCU: ESP32-C3 SuperMini (Top Layer, offset x=-2.5mm)
IMU: MPU-6050 / GY-521 (Backside Layer, x=+9.0mm)
Microphones: MAX4466 (Analog G0) & INMP441 (I2S)
Tactile Driver: AO3400A N-MOSFET (GPIO 7 PWM)
Haptic Protection: SS14 Flyback (D_HAP) + R_GATE 10kΩ
High-Side LED Cutoff: AO3401A P-MOS + AO3400A (GPIO 10)
Auto Power-Path: AO3401A P-MOS + SS14 + 100kΩ
LiPo Charger: MCP73831 + 2kΩ PROG (500mA) + Caps
Outputs: 3× Addressable LED Channels & Dual Haptics
Power & Controls: 1S LiPo Battery Solder Pads & External Power Switch
Mounting: 4× M3 Corner Holes (Ø3.2mm, 31×31mm spacing)

Laser Fit-Check & Documentation

📖 Architecture Writeup (.md) 📑 Developer & Pinout Specs (.md) 🧪 Wokwi & SPICE Simulation (.md)

DRC & Design Stats

DRC: Ready

Components: -

SMT Pads: -

Render Time: -

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